Thermal Adhesive Tape Pad – Alternative to Thermal Paste/Grease Apply to Heatsink,LED,IGBT, IC Chip,Computer CPU,GPU,Modules, MOS Tube,SSD Drives (25M x 10mm x 0.25mm)
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?thermal conductivity double-sided adhesive With high thermal conductivity and insulation properties and compression, adhesion,Can fill the uneven surface,Can be tightly and firmly fit the heat source devices and heat sink,Has strong adhesive strength,and thermal resistance is small,effectively replace the grease and mechanical fixation,A large number of applications in the bonding heat sink to the microprocessor and other power consumption of the semiconductor. ?Widely applied: high power LED,High power power supply, automotive electronic heating module, motor controller, communication equipment, power semiconductor, MOS tube, power tube, IGBT chip, high voltage, high temperature, high power welder, display, computer, Video Card RAM, DDR Memory Modules, SSD drives,solar , New energy heating power devices. ?Features: With the features of high thermal conductivity, insulation, strong stickiness, softness, compression, thermal double conductive tape is great helper to solve heat dissipation for many electronics products. ?Easy to use: Just stick on surface of any object and tear the blue release paper, which can be tightly and firmly conglutinate on the heat source devices and heat sink to speed the heat dissipation. ?Double-sided thermal adhesive tape at low cost solve the problem of both good heat dissipation and strong stickness, while improving the work efficiency. Which make the heat sink and IC chip bonding, make high power LED and heat aluminum bonding, replaced with a screw fixed, to achieve the most effective thermal dissipation.